| EMECMOLD | This project is closed |
| Low-Cost Automatic In-Mould Embedding of Electronics within Automotive Polymer Mouldings |
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Context In recent years, there has been a dramatic increase in the use of electronics within vehicles. This has become necessary to meet the growing requirements and complexity in systems for emission reduction, safety, comfort and communications. Electronic devices are also becoming more distributed within the vehicle as manufacturers take advantage of multiplexed architectures. Vehicle manufacturers require their suppliers to offer lower-cost modules with higher levels of integration, which must fit within shrinking space envelopes. Engineering plastics also feature strongly in vehicles because they offer geometrical flexibility in design, low weight, low cost and the ability to survive in exacting automotive environments. Aims To encapsulate electronic circuitry within structural mouldings, increasing the functionality of the overall structure through mechatronic integration of sensors and actuators. Method Define and rank requirements for the technology from the vehicle manufacturer and the supplier. Select possible encapsulation technologies to meet these requirements. Determine the influence of a range of parameters on the physical integrity of overmoulded assemblies. Define detailed functional testing of circuits under process and service conditions. Create and test component and process demonstrators Assimilate data from the project into a series of design rules that will define the technical and cost boundaries associated with the technology. Benefits Lower manufacturing costs Improved component robustness/reliability Potential for increased functionality Reduced package size Participants TRW Automotive Tunewell Technology Ltd Pera International Engel (UK) Ltd Loughborough University Middlesex University |
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